Next Generation Electronics
With Active Devices

in Three Dimensions

Next Generation Electronics With Active Devices

in Three Dimensions

Archive: cfaed Upcoming Events

Michael Niemier

Professor and Associate Department Chair, Computer Science and Engineering, University of Notre Dame, USA

Strategies for Evaluating the Impact of Emerging Memory Technologies at the Application-Level

Steven J. Koester

Department of Electrical Engineering, University of Notre Dame, Notre Dame, IN, USA

Toward a Manufacturable Contact Process for 2D TMD MOSFETs using Atomic Layer Deposition

Maximilian Thomas Birch

RIKEN Center for Emergent Matter Science, Japan

Emergent phenomena in nanosculpted devices of quantum materials

Harald Krüger

Aufsichtsrats der Deutschen Telekom AG // Deutschen Lufthansa AG

Berufs- und Karriereeinstieg unter volatilen wirtschaftlichen Rahmenbedingungen

Supriya Chakraborty

Chair of Integrated Digital Systems and Circuit Design | RWTH Aachen

Friday Get-together: Emerging Non-Volatile Memory (NVM) Technologies: From Device to Application (tutorial)

11. MikroSystemTechnik Kongress 2025

Memristec Summer School (memristec)

Active-3D Kick-Off Meeting

Dresden Microelectronics Academy

Sebastian T. B. Goennenwein

University of Konstanz

Anisotropic Magneto-Transport and Magneto-Thermopower Response of Crystalline Magnetic Films

Sandro Carrara

Bio/CMOS Interfaces Laboratory, EPFL, Switzerland

In-Memory Sensing by Switching Devices

Steven Koester

University of Minnesota, USA

Can ALD TMDs Solve the Contact Problem for 2D Channel p-MOSFETs?

Barbaros Oezyilmaz

National University of Singapore

Harnessing Structural Disorder: Multilayer 2D Amorphous Carbon in Next-Generation Microelectronics

3rd NC-Day 2025

Prof. Dr.-Ing. Dirk Plettemeier et al.

16th German Microwave Conference (GeMiC)

Various

MAKRO 2024 - Polymers for a Sustainable Future

Stephen A. Edwards

Computer Science Department, Columbia University, USA

The Sparse Synchronous Model