Guest Talk: Lukas Lorenz "Hochdichte Chipletsysteme dank quasi-monolithischer Integration"

This Friday, Lukas Lorenz, group leader for packaging and heterointegration at Fraunhofer IPMS, Dresden, gave a talk on high-density chiplet systems and quasi-monolithic integration.
Lukas talked about a method for fusing chiplets from different manufacturing technologies into a single unit. Through precise embedding in cavities (pockets) at the wafer level, researchers have succeeded for the first time in combining the advantages of a compact, monolithic single chip with the flexibility of modular systems. This is achieved through so-called quasi-monolithic integration (QMI) and bridges the gap between traditional chip packaging and state-of-the-art semiconductor manufacturing.

Many thanks to Lukas for this highly interesting talk.