Next Generation Electronics
With Active Devices

in Three Dimensions

Next Generation Electronics With Active Devices

in Three Dimensions

Ultrafast Wireless and Chip Design at the DATE Conference in Dresden

Deutsche Version unter "read more"

  • TU Dresden represented with joint booth of 5G Lab Germany, the cfaed Cluster of Excellence and the HAEC Collaborative Research Centre at the important conference on Design, Automation and Test in Europe
  • Accompanied by: the first cfaed Symposium “Advancing Electronics”

Every two years the DATE conference makes a stop in Dresden. It is a prime, international event for all industry and science stakeholders involved in the design and engineering of Systems-on-Chip, Systems-on-Board and Embedded Systems Software. Apart from the participating scientists, TU Dresden is also represented at the accompanying exhibition with a joint booth of 5G Lab Germany, the Cluster of Excellence ‘Center for Advancing Electronics Dresden’ (cfaed) and the Collaborative Research Centre 912 ‘Highly Adaptive Energy-Efficient Computing’ (HAEC).

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