Devices are one of the most important building blocks of integrated circuits. They derive their electrical characteristics from the properties of the materials they are made of and their functionality from the circuit they are embedded in. Within Research Area A we have therefore grouped projects that are devoted to the exploration of BEOL-compatible logic and memory devices based upon novel device architectures and novel materials. This work is tightly connected to Research Areas B and C in order to ensure that the resulting devices fulfill their targeted functionality in circuit blocks and are manufacturable in a reproducible way employing appropriate BEOL-compatible fabrication processes. Furthermore, fabricated devices will be used to extract parameters for Research Area B and to validate the modeling and simulation work done in Research Area C.

• Process flows for a BEOL compatible fabrication of the individual devices
• Performance parameters that can experimentally be realized in the lab process
• Envisioned performance parameters of the individual devices extrapolated to a scaled technology under the verified boundary conditions for BEOL integration
• Layout constraints of the individual devices
• Requirements for connecting to other devices in the same layer and on different layers
• Expected heat dissipation of the individual devices in a scaled technology

• Full lab based process flows to integrate the devices in reasonable combinations into the BEOL
• Expected process flows in scaled down technologies to integrate the different devices in reasonable combinations into the BEOL
• Lab scale demonstrators to verify and highlight the benefits of the ABEOL approach
• Flexible process routes across the different labs involved in the TRR
• Flexible connecting elements for two- and three-terminal devices that can be extended towards future device options
• Effective methods for limiting local heat dissipation hot spots by design measures and methods
  for physical heat distribution