Next Generation Electronics
With Active Devices

in Three Dimensions

Next Generation Electronics With Active Devices

in Three Dimensions

Publications

Nr. Subproject Publication Year
61 A07 Molenda, Z., Scalon, L., Singh, S. & Vaynzof, Y. Interfacial Energetics in Metal Halide Perovskite Solar Cells. In: Chemical reviews. 126, 17, p. 9725-9794 70 p. 9 Sept 2026. https://doi.org/10.1021/acs.chemrev.5c00782 2026
60 A04 Das, A.; Schneider, S.; Jeon, J.-C.; Kwon, J.; Parkin, S. S. P. High Resolution Imaging of Ultrathin PMA Films for Racetrack Applications, 2026. 2026
59 C03; C02 Yu, C.; Schneider, S.; Rellinghaus, B.; Jungemann, C. Drift‑Diffusion Simulation for Quantitative Interpretation of STEM‑EBIC on FIB‑Prepared Silicon p‑n Junctions, 2026. 2026
58 C02 Chen, Y.; Storelli, D.; Zhao, X.; Bende, A.; Manea, P.-P.; Artner, O.; Ashok, A.; Winterberg, K.; Paul, G.; Jia, S.; Roth, C.; Kusuma, S.; Schiek, M.; Rana, V.; Wouters, D.; Menzel, S.; Zambanini, A.; Grewing, C.; Wiefels, S.; Hoffmann‑Eifert, S.; Strachan, J. P.; Waasen, S. van; Dittmann, R. OTTER – Two Transistor – One RRAM Architecture for Reliable In‑Memory‑Computing in 28 Nm CMOS Technology. arXiv September 8, 2026. https://doi.org/10.48550/arXiv.2609.08898 2026
57 A07; B04 Baskent, E.; Uzlu, B.; Wang, K.-T.; Wang, Z.; Lemme, M. C.; Negra, R. Compact Metal‑Insulator‑Graphene Diode‑Based Differential Distributed Phase Shifter. IEEE Microw. Wireless Tech. Lett. 2026, 1‑4. https://doi.org/10.1109/LMWT.2026.3727345 2026
56 A04 Jeon, J.-C.; Fischer, L.; Li, Y.-C.; Lei, R.; Parkin, S. S. P. Opportunities toward Scalable Domain‑Wall‑Based Spintronic Devices. ACS Nanoscience Au 2026. https://doi.org/10.1021/acsnanoscienceau.6c00113 2026
55 A03 Köttgen, J.; Driesch, N. von den; Pawlis, A.; Wuttig, M. Understanding and Designing Phase Change Materials: Insights from Atom Probe Tomography. arXiv August 5, 2026. https://doi.org/10.48550/ARXIV.2608.03932 2026
54 A01 Spithouris, D.; Hellwig, J.; Greatorex, H.; Wittberg, C.; Koutsogiannis, P.; Magén, C.; Chicca, E.; Dittmann, R. Volatile Memristive Devices With Tunable Temporal Dynamics For Event‑Based Sensing. Advanced Materials 2026, e74813. https://doi.org/10.1002/adma.74813 2026
53 A01; C03; C02; B02 Buczek, M.; Dossayev, I. T.; Wittberg, C.; Liu, Y.; Goß, K.; Mueller, D. N.; Moos, Z.; Liu, Z.; Bittkau, K.; Sultani, M. H.; Menzel, S.; Hoffmann‑Eifert, S.; Dittmann, R. Amorphous, Highly Conductive Pr₀.₇ Ca₀.₃ MnO₃ for Area‑Dependent Resistive Switching AlOₓ Bilayer Devices. Adv Elect Materials 2026, 12 (17), e00556. https://doi.org/10.1002/aelm.202500556 2026
52 A03; A05; B01 Cui, H.; Zheng, K.; Knoch, J.; Ingebrandt, S. Van Der Waals Integration of Tellurium Nanowires With Graphene Oxide for Performance‑Enhanced Ion‑Sensitive Field‑Effect Transistors. Small 2026, e75853. https://doi.org/10.1002/smll.75853 2026
51 B07 Aliagha, E.; Amutha, V. S. M.; Göhringer, D. FT‑CGRA: Compiler‑Transparent Fault Tolerance for CGRAs. In 2026 IEEE 37th International Conference on Application‑specific Systems, Architectures and Processors (ASAP); IEEE: London, United Kingdom, 2026; pp 117‑124. https://doi.org/10.1109/ASAP71856.2026.00027 2026
50 A04 Dong, T.; Deka, J.; Fang, C.; Farinha, A. M. A.; Guan, Y.; Yang, S.; Parkin, S. S. P. Current‑Induced Domain Wall Dynamics in Pt/Co/Ni/Co Nanoribbons With Curvilinear Cross‑Sections. Advanced Materials 2026, e74919. https://doi.org/10.1002/adma.74919 2026
49 C03 Makino, H.; Rellinghaus, B.; Schneider, S.; Lubk, A.; Pohl, D. Noise Estimation and Suppression in Quantitative EMCD Measurements. Ultramicroscopy 2026, 284, 114372. https://doi.org/10.1016/j.ultramic.2026.114372 2026
48 C03; A04 Winter, M.; Pignedoli, A.; Rahn, M. C.; Sukhanov, A. S.; Achinuq, B.; Bollard, J. R.; Azhar, M.; Everschor‑Sitte, K.; Pohl, D.; Schneider, S.; Tahn, A.; Ukleev, V.; Valvidares, M.; Thomas, A.; Wolf, D.; Vir, P.; Helm, T.; Van Der Laan, G.; Hesjedal, T.; Geck, J.; Felser, C.; Rellinghaus, B. Field‑Induced Condensation of π to 2π Soliton Lattices in Chiral Magnets. Commun Phys 2026, 9 (1), 264. https://doi.org/10.1038/s42005-026-02785-3 . 2026
47 A03; A05 Frahm, T.; Liebisch, P.; Heiß, J.; Ingebrandt, S.; Knoch, J. Mitigating the Degradation of Metal‑Semiconductor Contacts with Optimized Electron Beam Evaporation. Micro and Nano Engineering 2026, 32, 100368. https://doi.org/10.1016/j.mne.2026.100368 . 2026
46 A03 Zhou, X.; Pan, Y.; Grap, T.; Ingebrandt, S.; Gao, Z. Design and Fabrication of Complex Micro‑Nano Structures for Osteogenesis Interfacing in 3D. Small Structures 2026, 7 (8), e70554. https://doi.org/10.1002/sstr.70554 . 2026
45 B05 Darjani, A.; Ramasamy, P.; Kavand, N.; Kumar, A. EAGEL: Explainable And Generalized Structural Exploitation Against Logic Locking. In Proceedings of the Great Lakes Symposium on VLSI 2026; ACM: Canandaigua, NY, USA, 2026; pp 156‑163. https://doi.org/10.1145/3787109.3815258 . 2026
44 A07 Bou, A.; Riquelme, A. J.; Shilovskikh, V.; Rivkin, B.; Vaynzof, Y. Emergence of Memristive Behavior in Perovskite Devices by Stoichiometric Engineering. ACS Energy Lett. 2026, 11 (5), 4094‑4102. https://doi.org/10.1021/acsenergylett.6c00659 . 2026
43 B05 Kavand, N.; Niranjan, T.; Darjani, A.; Kumar, A. RETRO: Mitigating Power Side‑Channel Attacks with Reconfigurable RFET‑Based Ring Oscillators. In 2026 Design, Automation & Test in Europe Conference (DATE); IEEE: Verona, Italy, 2026; pp 1‑7. https://doi.org/10.23919/DATE69613.2026.11539368 . 2026
42 A01; A02 Yuan, P.; Schnieders, K.; Wang, Y.; Ntinas, V.; Pereira, M. E.; Rana, V.; Ascoli, A.; Tetzlaff, R.; Dittmann, R.; Menzel, S. Novel M‑CNN Design Fostering Gradual Switching of InGaZnO(IGZO)‑Based Memristive Devices. In 2026 IEEE International Symposium on Circuits and Systems (ISCAS); IEEE: Shanghai, China, 2026; pp 4538‑4542. https://doi.org/10.1109/ISCAS66217.2026.11562042 . 2026
41 A01 Hellwig, J.; Wittberg, C.; Spithouris, D.; Dittmann, R. Two Coexisting Pathways to Volatility in Valence‑Change Memory Devices. Adv Funct Materials 2026, e77515. https://doi.org/10.1002/adfm.77515 . 2026
40 A01; C02; B02 Artner, O.; Cüppers, F.; Son, S.; Chen, Y.; Liu, X.; Bengel, C.; Nielinger, D.; Zambanini, A.; Wiefels, S.; Menzel, S.; Dittmann, R.; Hoffmann‑Eifert, S. The Influence of Residual Ion Drift During Programming of Chip‑Integrated Nanoscale HfO₂‑Based Memristive Devices. Adv Elect Materials 2026, e00891. https://doi.org/10.1002/aelm.202500891 . 2026
39 A07 Starodubtceva, L.; Kadid, A.; Kurahashi, N.; Kreusel, C.; Ruhkopf, J.; Lukas, S.; Plachetka, U.; Heiderhoff, R.; Riedl, T.; Mohammadi, M.; Lemme, M. C. Improved Heat Dissipation in CsPbBr₃‑hBN Heterostructures. Mater. Adv. 2026, 10.1039.D6MA00217J. https://doi.org/10.1039/D6MA00217J . 2026
38 A07 Fabrizi, F.; Esteki, A.; Lerch, H.; Goudarzi, S.; Starodubtceva, L.; Müller‑Newen, G.; Mohammadi, M.; Lemme, M. C. Wafer‑Scale Top‑Down Patterning of Metal Halide Perovskites. Zenodo August 31, 2026. https://doi.org/10.5281/ZENODO.21285455 . 2026
37 A01; C03 Yuan, P.; Wittberg, C.; Deuermeier, J.; Elias Pereira, M.; Liu, Y‑P.; Mueller, D. N.; Kiazadeh, A.; Dittmann, R. Band‑Engineering in Area‑Dependent InGaZnO(IGZO)‑Based Memristive Devices. Front. Nanotechnol. 2026, 8, 1870683. https://doi.org/10.3389/fnano.2026.1870683 . 2026
36 A01; B02 Sudarshan, C.; Artner, O.; Manea, P.; Siegel, S.; Hoffmann‑Eifert, S.; Dittmann, R.; Strachan, J. P. A Flexible and Energy‑Efficient Compute‑in‑Memory Accelerator for Kolmogorov‑Arnold Networks. Advanced Intelligent Systems 2026, e202501220. https://doi.org/10.1002/aisy.202501220 . 2026
35 A03 Khan, D.; Homma, C.; Romdhane, A. B.; Bahri, H.; Du, X.; Vu, X. T.; Ingebrandt, S.; Pachauri, V. A Distributed Bragg Reflector Interface for Filter‑Free Fluorescence Spectro‑Microscopy With High Spectral Tunability. Physica Status Solidi (a) 2026, 223 (8), e70337. https://doi.org/10.1002/pssa.70337 . 2026
34 A03 Pfeiffer, R. Optimizing Crystallization Kinetics and Reducing Stochasticity of the Phase‑Change Materials Sb₂Se₃ and Ge₂SeTe through Controlled Crystalline Interface Growth; DPG Spring Meeting, Dresden, Germany, 2026. 2026
33 A07 Mohammadi, M.; Stoll, S. L.; Herrero, A. F.; Khan, S.; Fabrizi, F.; Gollwitzer, C.; Wang, Z.; Anantharaman, S. B.; Lemme, M. C. Wafer‑Scale Synthesis of Mithrene and Its Application in UV Photodetectors. Adv Funct Materials 2026, 36 (15), e17857. https://doi.org/10.1002/adfm.202517857 . 2026
32 A01 Moos, Z.; Buczek, M.; Liu, Z.; Manu, A.; Gutsche, A.; Dittmann, R. CMOS Integration of Area‑Dependent Pr₀.₇Ca₀.₃MnO₃‑Based ReRAM‑Devices; 8th International Conference on Memristive Materials, Devices & Systems (MEMRISYS 2025), Edinburgh, United Kingdom, 2025. 2025
31 A01 Wittberg, C.; Spithouris, D.; Hellwig, J.; Dittmann, R. Identifying the Electronic and Ionic Transport in Area‑Dependent VCM.; 8th International Conference on Memristive Materials, Devices & Systems (MEMRISYS 2025), Edinburgh, United Kingdom, 2025. 2025
30 A03 Wuttig, M. Designing Thermoelectrics by Tailoring Chemical Bonds; MRS Fall Meeting, Boston, USA, 2025. 2025
29 A03 Wuttig, M. Tailoring Phase Change Materials for Different Applications: The Role of Metavalent Bonding; EP\COS 2025, Marseille, France, 2025. 2025
28 C03 Schneider, S.; Pohl, D.; Rellinghaus, B. Perspectives and Limitations of STEM EBIC Measurements for the Characterization of Semiconductor Devices. Microscopy and Microanalysis 2025, 31 (Supplement_1), ozaf048.888. https://doi.org/10.1093/mam/ozaf048.888 . 2025
27 B06 Khan, Asif Ali, and Jeronimo Castrillon. "LearnCNM2Predict: Transfer Learning‑based Performance Model for CNM Systems." https://cfaed.tu-dresden.de/files/Images/people/chair-cc/publications/2507_daSilva_SAMOS.pdf 2025
26 B07 Shadmehri, H. H.; Lanius, C.; Gemmeke, T. A (145, 128) DEC‑TED BCH Decoder with Composite Field and Redundant Arithmetic. In 2025 IEEE Nordic Circuits and Systems Conference (NorCAS); IEEE: Riga, Latvia, 2025; pp 1‑7. https://doi.org/10.1109/NorCAS66540.2025.11231200 . 2025
25 A07 Fabrizi, F.; Goudarzi, S.; Khan, S.; Mohammad, T.; Starodubtceva, L.; Cegielski, P. J.; Thiel, F.; Özen, S.; Schiffer, M.; Lang, F.; Bolívar, P. H.; Riedl, T.; Müller‑Newen, G.; Anantharaman, S. B.; Mohammadi, M.; Lemme, M. C. A Versatile Top‑Down Patterning Technique for Perovskite On‑Chip Integration. ACS Nano 2025, 19 (33), 30428‑30440. https://doi.org/10.1021/acsnano.5c10397 . 2025
24 B06 De Lima, J. P. C.; Moghadam, M. S.; Aygun, S.; Castrillon, J.; Najafi, M. H.; Khan, A. A. All‑in‑Memory Stochastic Computing Using ReRAM. In 2025 62nd ACM/IEEE Design Automation Conference (DAC); IEEE: San Francisco, CA, USA, 2025; pp 1‑7. https://doi.org/10.1109/DAC63849.2025.11132096 . 2025
23 A06 Rudenko, T.; Gomeniuk, Y. V.; Slobodian, O.; Lytvyn, P.; Reato, E.; Esteki, A.; Lemme, M. C.; Nazarov, A. Application of Gate‑to‑Channel Capacitance Measurements for Extraction and Investigation of the Effective Mobility in MoS₂ Field Effect Transistors with Hysteresis of Electrical Characteristics. Phys. Scr. 2026, 101 (10), 105909. https://doi.org/10.1088/1402-4896/ae4ae6 . 2026
22 B06 Farzaneh, H.; Khan, A. A.; Castrillon, J. CoMoNM: A Cost Modeling Framework for Compute‑Near‑Memory Systems. arXiv 2025. https://doi.org/10.48550/ARXIV.2508.11451 . 2025
21 B06 Castrillon, J. Compiler Support for Ferroelectric Compute‑in‑Memory Solutions (and Beyond), 205 AD. 2025
20 B06 De Lima, J. P. C.; Morris, B.; Khan, A. A.; Castrillon, J.; Jones, A. K. Count2Multiply: Reliable In‑Memory High‑Radix Counting. In 2026 IEEE International Symposium on High Performance Computer Architecture (HPCA); IEEE: Sydney, Australia, 2026; pp 1‑15. https://doi.org/10.1109/HPCA68181.2026.11408436 . 2026
19 B06 Hu, X. S.; Lee, M.-Y.; Li, M.; Lima, J. P. C. D.; Liu, L.; Zhu, Z.; Castrillon, J.; Niemier, M.; Wang, Y. Cross‑Layer Design and Design Automation for In‑Memory Computing Based on Non‑volatile Memory Technologies. IEEE Des. Test 2025, 42 (6), 75‑86. https://doi.org/10.1109/MDAT.2025.3603495 . 2025
19 B06 Hu, X. S.; Lee, M.-Y.; Li, M.; Lima, J. P. C. D.; Liu, L.; Zhu, Z.; Castrillon, J.; Niemier, M.; Wang, Y. Cross‑Layer Design and Design Automation for In‑Memory Computing Based on Non‑volatile Memory Technologies. (duplicate entry, year 2026 in original list) 2026
18 B06 Castrillon, J., Giceva, J., Hua, Y., Keeton, K., Shekar, A., Skadron, K., … & Zhang, H. Declarative Memory Services. CIDR 2026. 16th Annual Conference on Innovative Data Systems Research (CIDR ’26). January 18‑21, Chaminade, USA https://mail.vldb.org/cidrdb/papers/2026/p21-castrillon.pdf 2026
17 C01; A05; B05 Kavand, N.; Darjani, A.; Bhattacharjee, N.; Quijada, J. N.; Martinez, J. P.; Mikolajick, T.; Trommer, J.; Kumar, A. Design and Evaluation of an RFET Standard Cell Library Compatible with 22 Nm FDSOI. IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst. 2026, 1‑1. https://doi.org/10.1109/TCAD.2025.3649810 . 2026
16 B06 De Lima, J. P. C.; Dietrich, M.; Castrillon, J.; Khan, A. A. Efficient In‑Memory Acceleration of Sparse Block Diagonal LLMs. In 2025 Cross‑Disciplinary Conference on Memory‑Centric Computing (CCMCC); IEEE: Dresden, Germany, 2025; pp 1‑8. https://doi.org/10.1109/CCMCC67628.2025.11380618 . 2025
15 A07 Khan, S.; Goudarzi, S.; Schäffer, S.; Sonneveld, L.; Macco, B.; Ran, K.; Kurahashi, N.; Bolívar, P. H.; Ehrler, B.; Riedl, T.; Müller‑Newen, G.; Anantharaman, Surendra B.; Mohammadi, M.; Lemme, Max C. Facile Synthesis and On‑Chip Color Tuning of CsPbBr₃@CsPbBr₃₋ₓTFAₓ Nanoplatelets via Ion Engineering. arXiv 2025. https://doi.org/10.48550/ARXIV.2509.16290 . 2025
14 B05 Darjani, A.; Kavand, N.; Kumar, A. Flip‑Break: Breaking Flip‑Flop‑Based Logic Locking in Sequential Circuits. In Proceedings of the Great Lakes Symposium on VLSI 2025; ACM: New Orleans LA USA, 2025; pp 463‑469. https://doi.org/10.1145/3716368.3735189 . 2025
13 B05 Darjani, A.; Kavand, N.; Kumar, A. Flip‑Un‑Lock: An Anomaly Detection Attack on Flip‑Flop‑Based Logic Locking. In 2025 IEEE Computer Society Annual Symposium on VLSI (ISVLSI); 2025; Vol. 1, pp 1‑6. https://doi.org/10.1109/ISVLSI65124.2025.11130332 . 2025
12 B05 Ullah, S.; Sahoo, S. S.; Li, C.; Li, C.; Liu, L.; Pereira, T. S.; Wen, B.; Yin, X.; Darjani, A.; Kavand, N.; Bodla, C.; Panduga, R. Y.; Holemadlu, A.; Maly, J.; Förste, J.; Vadia, S.; Hu, X. S.; Kumar, A. Invited Paper: Circuit and Architecture Design with Emerging Computing Paradigms. In 2025 IEEE/ACM International Conference On Computer Aided Design (ICCAD); IEEE: Munich, Germany, 2025; pp 1‑9. https://doi.org/10.1109/ICCAD66269.2025.11240725 . 2025
11 A07 Sana Khan, Surendra B. Anantharaman, Maryam Mohammadi, Max C. Lemme, Monitoring Halide Exchange in Perovskite Films with Spectroscopic Ellipsometry, Proceedings of Emerging Light Emitting Materials 2025 (EMLEM25) La Canea, Greece, 2025 Oct 8‑10, Poster, https://www.nanoge.org/proceedings/EMLEM25/68c88be5d3083d187ce13720 . 2025
10 C01; A02 Ascoli, A.; Gemo, E.; Corinto, F.; Bonnin, M.; Gilli, M.; Civalleri, P. P.; Demirkol, A. S.; Messaris, I.; Ntinas, V.; Prousalis, D.; Tetzlaff, R.; Slesazeck, S.; Mikolajick, T.; Chua, L. Ndr Effects in a Locally‑Active Memristor Induce Small‑Signal Amplification in a Simple Cell. In 2025 14th International Conference on Modern Circuits and Systems Technologies (MOCAST); IEEE: Dresden, Germany, 2025; pp 1‑9. https://doi.org/10.1109/MOCAST65744.2025.11083728 . 2025
9 A01; C02 Buczek, M.; Moos, Z.; Gutsche, A.; Menzel, S.; Dittmann, R. Pr 1‑x Ca x MnO₃‑Based Memristive Heterostructures: Basic Mechanisms and Applications. Chem. Rev. 2025, 125 (13), 6156‑6202. https://doi.org/10.1021/acs.chemrev.4c00813 . 2025
8 B05 Kavand, N.; Darjani, A.; Niranjan, T.; Kumar, A. RAT: RFET‑Based Analog Hardware Trojan. In 2025 IEEE Computer Society Annual Symposium on VLSI (ISVLSI); IEEE: Kalamata, Greece, 2025; pp 1‑6. https://doi.org/10.1109/ISVLSI65124.2025.11130296 . 2025
7 C03 Schneider, S.; Beckert, S.; Hammer, R.; König, M.; Moldovan, G.; Pohl, D. STEM EBIC as a Quantitative Probe of Semiconductor Devices. arXiv 2025. https://doi.org/10.48550/ARXIV.2511.11528 . 2025
6 B05 Darjani, A.; Kavand, N.; Han, Z.; Kumar, A. Structurally Secure Obfuscation: Assessing and Mitigating Structural Vulnerabilities in Circuits Obfuscation. ACM Trans. Des. Autom. Electron. Syst. 2026, 31 (1), 1‑30. https://doi.org/10.1145/3772062 . 2026
5 C01; A02 Wang, S.; Li, Z.; Pei, M.; Ren, Q.; Deng, M.; Ang, K.-W.; Ascoli, A.; Banerjee, S.; Bonnin, M.; Van De Burgt, Y.; Cheng, B.; Chua, L.; Civalleri, P. P.; Corinto, F.; Cui, T. J.; Das, S.; Demirkol, A. S.; Van Dijken, S.; Fan, Y.; Fang, L.; Farronato, M.; Feng, Z. R.; Gemo, E.; Gilli, M.; Goswami, S.; He, Y.; Huang, C.; Huang, Q.; Hwang, C. S.; Ielmini, D.; Jang, Y. H.; Kuncic, Z.; Lemme, M. C.; Li, C.; Liang, S.‑J.; Liu, K.; Liu, S.; Luo, J.; Ma, Q.; Maass, W.; Mannocci, P.; Messaris, I.; Miao, F.; Mikolajick, T.; Ntinas, V.; Ponis, J.; Prodromakis, T.; Prousalis, D.; Shao, Q.; Slesazeck, S.; Strachan, J. P.; Tan, H.; Tang, J.; Tetzlaff, R.; Tran, L. P. L.; Valov, I.; Vorias, A.; Wang, B.; Wang, J.; Wang, S.; Wang, X.; Wang, Y.; Wu, H.; Xia, Q.; Xiao, K.; Xiao, Z.; Xiong, Z.; Xu, T.; Yang, M.‑J.; Yang, Y.; Zhang, W.; Chai, Y. Technology Roadmap of Bioinspired Computing Hardware. ACS Nano 2026, 20 (10), 8102‑8163. https://doi.org/10.1021/acsnano.5c17087 . 2026
4 B07 Aliagha, E.; Göhringer, D. Toward Domain‑Aware Energy‑Efficient Reconfigurable Architectures. In 2025 International Conference on Field Programmable Technology (ICFPT); IEEE: Shanghai, China, 2025; pp 280‑281. https://doi.org/10.1109/ICFPT67023.2025.00055 . 2025
3 A06 Li, D.; Zheng, W.; Ghorbani‑Asl, M.; Scheiter, J.; Sobczak, K.; Kretschmer, S.; Polčák, J.; Jadhao, P. H.; Michałowski, P. P.; Yu, R.; Zhang, J.; Liu, J.; Du, J.; Guo, Q.; Zschech, E.; Šikola, T.; Bonn, M.; Pérez, N.; Nielsch, K.; Krasheninnikov, A. V.; Wang, H. I.; Yu, M.; Feng, X. Triphasic Synthesis of MXenes with Uniform and Controlled Halogen Terminations. Nat. Synth 2026. https://doi.org/10.1038/s44160-025-00970-w . 2026
2 B06 Khan, A. A.; Benmeziane, H.; Farzaneh, H.; Lima, J.; Simon, W.; Shi, Y.; Yan, Z.; Sebastian, A.; Hu, X. S.; Castrillon, J.; Lammie, C. Tutorial: Hardware‑Aware Compilation and Simulation for In‑Memory Computing. In Proceedings of the International Conference on Compilers, Architecture, and Synthesis for Embedded Systems; ACM: Taipei International Convention Center (TICC) Taipei Taiwan, 2025; pp 31‑32. https://doi.org/10.1145/3742872.3758333 . 2025
1 A06 Rademacher, N.; Völkel, L.; Reato, E.; Otto, M.; Krotkus, S.; Mischke, J.; Yengel, E.; Mauder, C.; Henning, A.; Heuken, M.; Ran, K.; Mayer, J.; Lemme, M. C. Water‑Based, Large‑Scale Transfer of 2D Materials Grown on Sapphire Substrates. npj 2D Mater Appl 2026, 10 (1), 48. https://doi.org/10.1038/s41699-026-00696-z . 2026

Publications list at TU Dresden Research Portal (FIS)