Next Generation Electronics
With Active Devices

in Three Dimensions

Next Generation Electronics With Active Devices

in Three Dimensions

News

TRR Members at the Dresden Microelectronics Academy Summer School 2026

Members of our TRR404 participated in the this year's Dresden Microelectronics Academy 2026. The summer school brought together students, early-career researchers, and experts from academia and …

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Guest Talk: Lukas Lorenz "Hochdichte Chipletsysteme dank quasi-monolithischer Integration"

This Friday, Lukas Lorenz, group leader for packaging and heterointegration at Fraunhofer IPMS, Dresden, gave a talk on high-density chiplet systems and quasi-monolithic integration.Lukas talked about …

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10th Anniversary Symposium on Schottky Barrier MOS Devices Co-hosted by Active-3D

From 31 August to 1 September, Joachim Knoch hosted the 10th edition of the annual Symposium on Schottky Barrier MOS Devices (SSBMOS). The goal of the symposium is to promote the research of Schottky …

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75th Lindau Nobel Laureate Meeting - Personal Report by Ph.D. student Clemens Wittberg

As reported here before, our Ph.D. student Clemens Wittberg (Jülich Research Center) had the honor to be invited to participate in the 75th Lindau Nobel Laureate Meeting! During the week, Wittberg …

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Guest Talk: Juliana Panchenko "From Microinterconnects to Systems: Advanced Packaging Technologies for HPC and AI"

Last Friday, we welcomed Juliana Panchenko of Technische Universität Dresden for our latest Friday Get-together. Juliana gave an inspiring overview of recent advances in fine-pitch interconnect …

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